85969-8

Cut Strip - MOD IV RECP PLTD 30 SEL

Enhance your power and signal connections with the MOD IV RECP PLTD 30 SEL. Featuring a durable beryllium copper construction with gold plating, these female connectors ensure reliable performance. With CSA LR7189 and UL E28476 certifications, they meet stringent quality standards. Suitable for wire sizes 20-24 AWG, they offer easy crimp termination. Operating at up to 250 VAC and 750 V dielectric withstanding voltage, they guarantee safe and efficient connectivity. RoHS compliant and packaged in bulk quantities, these connectors are ideal for industrial applications.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 85969-8
Series:AMPMODU IV/V
Gender:Female
Termination Method:Crimp
Contact Material:Beryllium Copper
Contact Plating:Gold
Voltage:250 VAC
Contact Type:Socket
Package Quantity:12500
Insulation Resistance:5000 MΩ
GPL:277
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
GPL Description:Industrial
Connector and Contact Terminate To:Wire & Cable
Wire Size:20 - 24 AWG, .2 - .6 mm²
ECCN:EAR99
Dielectric Withstanding Voltage:750 V
Termination Resistance:12 mΩ
Applied_Pressure:Standard
Wire Insulation Support:With
Compatible Wire / Cable Type:Discrete Wire
Wire Contact Termination Area Plating Material:Gold Flash
Wire Contact Termination Area Plating Thickness:30 µin
Standards Met:CSA LR7189 UL E28476
Part Aliases:85969-8
SKU:AMP85969-8.P

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
05/29/2015P-15-011207 - Product improvement. UPDATING ESTIMATED FIRST SHIP DATE FOR CHANGED PARTS DUE TO DELAY IN PROCESSING ENGINEERING CHANGE.Download
03/01/2015E-14-017571 - PRODUCT IMPROVEMENT. CU-NI-SI MATERIAL PASSES 108-25020 REQUIREMENTS. STANDARDIZATION OF THE BASE MATERIAL OF MOD IV RECEPTACLE CONTACTS. MATERIAL CHANGE FROM BERYLLIUM COPPER TO COPPER-NICKEL-SILICON.Download
04/01/2013Project Lantern PTP Migration Parts - MNF. location change from NC.Download