22-11-2082
KK 254 Solid Header, Vertical, with Friction Lock, 8 Circuits, Gold (Au) Plating
Enhance your electronic connections with the KK 254 Solid Header. Designed for vertical mounting, this header features a secure friction lock and accommodates 8 circuits with gold plating for optimal conductivity. Crafted from durable nylon with brass contacts, it ensures reliable performance in various applications. With a pitch of 2.54mm and a 4A amperage rating, it offers compatibility with standard wire-to-board setups. RoHS compliant and suitable for lead-free soldering, it meets industry standards for environmental responsibility. Whether for prototyping or production, this header is a reliable choice for your PCB connector needs.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 22-11-2082 |
| Color: | Natural (White) |
| Series: | 6373 - KK 254 |
| Amperage: | 4 A |
| Connector Type: | KK 254 |
| Number of Contacts: | 8 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 500 V |
| Material: | Nylon |
| Orientation: | Vertical |
| Tail Length: | 3.56 mm |
| Contact Mating Area Plating: | Gold |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 50 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Maximum Solder Process Temperature: | 235 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 2.54 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Partial |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0022112082;A-6373-08A241 |
| SKU: | MOL22-11-2082 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change |
Download |
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. |
Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 11/30/2020 | 509221 - Retraction of PCN 506276. retraction of DU min & MLQ Min qty update for kk part numbers | Download |
| 09/01/2019 | 507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
| 07/01/2019 | 507163 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |
| 04/25/2019 | 506276 - Packaging Method/Quantity Changing. The part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. |
Download |
| 08/31/2017 | 502084 - Capacity change or tool replacement. | Download |
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 04/15/2016 | GCM 10734164 - New, Modified, Or Replacement Tooling. | Download |
| 03/18/2016 | 500669 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes and quantities. No changes will be made to the product as a result of the packaging change. | Download |
| 03/15/2016 | GCM 10738297 - New, Modified, Or Replacement Tooling. This letter is to inform you that a replacement mold is being built for the housings used on 6373, 7478, 7832, 171856, and 171857 series. Engraving location will change from the top corners to the back of the housing, and the slots on the side of the part will be modified for easier ejection. This change will not affect function of the part. Additionally, the new mold will run at the Maumelle, Arkansas facility instead of the Lincoln, Nebraska facility. | Download |
| 02/01/2012 | GCM 10523658 - Changing selected Mini-Fit and KK Product that were Overall Gold Plated Terminals to Select Gold, or Gold only in the contact area, and Matte Tin in solder tail area (changing solder tails from Overall Gold Plating to Matte Tin Plating). | Download |
| 02/01/2012 | GCM 10534789 - Plating changed from all over Gold Plating to Selective Gold Plating. |
Download |