43650-0400

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 4 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Glow-Wire Capable, Black

Part Aliases: Molex 0436500400  
Discover the Micro-Fit 3.0 Right Angle Header, a precision-engineered connector designed for seamless integration in your electronic projects. With a 3.00mm pitch and a single row layout, this header boasts 4 circuits, ensuring reliable connectivity. Featuring a Snap-in Plastic Peg PCB Lock for secure mounting, it's crafted from durable high-temperature thermoplastic in a sleek black finish. Glow wire capable and meeting RoHS compliance, this connector offers peace of mind in terms of safety and environmental standards. With a current rating of 8.5A and a voltage tolerance of 600V, it's suitable for a wide range of applications. Its right-angle body orientation and through-hole termination method make it versatile and easy to install. Whether you're working on industrial machinery or consumer electronics, the Micro-Fit 3.0 is the perfect choice for efficient power and signal transmission. Trust in its quality construction and performance, backed by industry-leading specifications and testing. Elevate your projects with the Micro-Fit 3.0 Right Angle Header.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0400
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:4
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500400
SKU:MOL43650-0400

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
11/22/2024515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales.
Product Change Notice Download
10/05/2022512289 - Capacity Change/Tool Replacement.
This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling
Product Change Notice Download
08/01/2021510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Product Change Notice Download
06/01/2021510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
Product Change Notice Download
02/26/2021509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & QualityProduct Change Notice Download
12/31/2020508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier.Product Change Notice Download
07/01/2017502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.Product Change Notice Download
05/06/2015GCM 10664055 - Manufacturing Process Change.Product Change Notice Download