AirBorn Interconnect Solutions

For over sixty years, AirBorn has been serving OEMs (original equipment manufacturers) with specialized harsh environment connectors, cable assemblies, and other electronic components. These products are engineered and manufactured to the highest quality, using Six Sigma and lean manufacturing principles.

AirBorn solutions are found worldwide throughout many industries, including aerospace, energy, geophysical, industrial, instrumentation, marine, medical, military/defense, space exploration, storage/networking, and telecommunications.

Heilind offers a broad portfolio of AirBorn interconnects, including cable and board mount connectors designed to MIL-DTL-32139, MIL-DTL-83513, and MIL-DTL-55302 specifications. We also offer the complete line of proprietary AirBorn parts. Click here to check our stock.

Below is a sample of our AirBorn offering:

M Series:

Contact spacing: .050" (1.27mm), approved to MIL-DTL-83513 Rugged Micro-D with extensive mix of termination styles and custom design capability. View PDF

microQUAD Series:

Contact Spacing: .050" (1.27mm) with .100" on quadrax Rugged Micro-D designed to handle LVDS serial bus signals like IEEE 1394, Ethernet, and serial rapid IO. View PDF

microSI Series:

Contact spacing: .070" (1.778mm) Rugged Micro-D designed for high-speed/signal-integrity applications (up to 10 GB) and flexibility; supports 1X, 4X, and 8X 100 Ω and 85 Ω differential serial buses. View PDF

N Series:

Contact spacing: .025" (.636mm), approved to MIL-DTL-32139 Nanominiature connectors for the smallest and most demanding spaces. View PDF

R Series:

Contact spacing: .075" (1.905mm), approved to MIL-DTL-55302 High-density connectors for board-to-board applications. View PDF

RC Series:

Contact spacing: .075" (1.905mm) High-density connectors for board-to-board stacking applications; one-piece contact system. View PDF

RCII Series:

Contact spacing: .075" (1.905mm) High-density connectors for board-to-board stacking applications; aligned contact field for improved signal integrity. View PDF

RZ Series:

Contact spacing: .050" (1.27mm) High-density connectors for board-to-board and flex circuit stacking applications; one-piece contact system. View PDF

Series 360:

Lightweight, watertight circular connectors with EMI shielding and compact housing. View PDF

verSI Series:

Contact spacing: .050" (1.27mm) Open-pin field connectors designed to meet the requirements for high-speed and high-density/signal integrity 100 Ω and 85 Ω differential serial bus applications. View PDF

W Series:

Contact spacing: .100" (2.540mm), approved to MIL-DTL-55302 High-density connectors for board-to-board applications. View PDF