Introducing the Z-PACK Future Bus+ Board-to-Board Connector, a high-performance solution for signal transmission in electronic systems. Designed for seamless integration on printed circuit boards, this connector features a right-angle mount orientation with through-hole solder termination, ensuring secure and reliable connectivity. With 72 gold-plated contacts on four rows, it offers a low impedance of 72 Ω and a high current rating of 10.5 A, making it ideal for demanding applications. The housing, crafted from UL 94V-0 rated LCP, guarantees durability and safety. Meeting RoHS compliance standards, this connector is also environmentally friendly. Its innovative design, including a polarizing rib for mating alignment and PCB retention with solder tail, simplifies assembly and maintenance. Whether used in telecommunications, industrial, or automotive sectors, this connector delivers exceptional performance in data and device connections. Elevate your connectivity solutions with the Z-PACK Future Bus+ Connector.
