1473149-4
SEMI-HARD TRAY ASSY DDR2 SODIMM 5.2H ST
Enhance memory module connectivity with this semi-hard tray assembly designed for DDR2 SODIMM application. Crafted with high-temperature thermoplastic housing, it ensures durable performance, meeting stringent UL 94V-0 standards for safety. Featuring a female gender and a total of 200 contacts in a 2-row configuration, this board-mountable assembly guarantees secure and efficient power delivery. With a contact material of copper alloy and gold flash plating in the mating area, it offers reliable conductivity. The right-angle body orientation, with a standard keying design, ensures proper alignment during installation. Operating at a voltage of 1.8V and a maximum temperature of 85°C, it suits various power applications. The black housing color, along with a standard profile, adds to its visual appeal and compatibility. Perfect for memory card sockets, this assembly, RoHS compliant and ECCN certified, is a vital component for data and device connectivity in electronic systems.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1473149-4 |
| Series: | DDR2 SO DIMM |
| Amperage: | .5 A |
| Gender: | Female |
| Housing Material: | High Temperature Thermoplastic |
| Number of Contacts: | 200 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Copper Alloy |
| Maximum Operating Temperature: | 85 °C |
| Body Orientation: | Right Angle |
| Pitch: | .024 in, .6 mm |
| Voltage: | 1.8 V |
| Socket Type: | Memory Card |
| Row Spacing: | .244 in, 6.2 mm |
| Keying: | Standard |
| Package Quantity: | 20 |
| Key Type: | SGRAM |
| Latch Material: | Stainless Steel |
| Contact Amperage: | .5 A |
| Number of Positions: | 200 |
| Housing Color: | Black |
| GPL: | 053 |
| Profile: | Standard |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold Flash |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Gold Flash |
| PCB Retention Type: | Solder Peg |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2969 |
| Connector System: | Cable-to-Board |
| ECCN: | EAR99 |
| Stack Height: | .205 in, 5.2 mm |
| Ejector Type: | Locking |
| PCB Mounting Style: | Surface Mount |
| Ejector Location: | Both Ends |
| Latch Plating: | Tin |
| Center Key: | None |
| DRAM Type: | Double Data Rate (DDR) |
| Insertion Style: | Cam-In |
| Socket Style: | SO DIMM |
| Module Orientation: | Right Angle |
| Standards Met: | UL 94V-0 |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1473149-4 |
| SKU: | AMP1473149-4 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/05/2022 | PCN-21-123177 - Document Updated. Please be aware the listed documents have been updated to improve clarity (not affecting specification of product). Add the alternative raw material for SODIMM contacts. Reason for Change: Due to global metal supply constraint, we can’t get enough metal materials(current: C44250), So we want to add the qualified material (C7025) for alternative raw materialBefore: Only one raw material. After: Add a alternative material. | Download |
| 03/01/2020 | P-19-018358 - Manufacturing Location Change -TE Connectivity (TE) is moving the manufacturing location of the products listed below from TE Shanghai to TE Qingdao. | Download |