2198226-2

SFP+ Enhanced 1x2, SAN Heatsink, LP

Enhance your SAN setup with our SFP+ 1x2 Cage Assembly, designed for optimal performance in high-speed networking environments. This Low Profile (LP) assembly features a SAN Heatsink for efficient heat dissipation, ensuring reliable operation even in demanding conditions. With two ports supporting a data rate of 16 Gb/s each, it offers seamless connectivity for your network infrastructure. The Through Hole - Press-Fit termination method guarantees secure attachment to the PCB, while the wide operating temperature range of -55 to 105 °C (-67 to 221 °F) ensures versatility in deployment. RoHS compliant and part of our SFP/SFP+/zSFP+ product line, this assembly is a quality choice for connectivity solutions.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198226-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198226-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
Lightpipe Style:Reduced Length
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: