Enhance your PCB connections with the Z-PACK Future Bus+ Board-to-Board Connector. Featuring a rugged LCP housing and press-fit termination method, this connector ensures reliable performance in demanding environments. With 60 gold-plated pin contacts, it supports power and signal transmission at up to 3A and 30V AC, ideal for high-speed data and device applications. The 5-row, 2mm pitch design offers a compact footprint, while UL 94V-0 flammability rating guarantees safety. Its vertical mount orientation and polarization alignment simplify assembly, while the 1000V AC dielectric withstanding voltage ensures robust insulation. RoHS compliant and suitable for temperatures ranging from -67 to 257°F, this connector is a versatile solution for your connectivity needs.
