The Z-PACK Future Bus+ is a high-performance board-to-board connector offering 168 signal positions in a compact, right-angle design. With a pitch of 2mm and gold plating on the contact mating area, it ensures reliable signal transmission in data and device applications. The housing, made of UL 94V-0 rated LCP, provides excellent durability and meets strict flammability standards. Featuring through-hole solder termination and a 30V AC voltage rating, this connector is suitable for a wide range of operating environments. Its polarization and mating alignment features ensure easy and secure assembly, while the inclusion of PCB retention and board standoff application solder features further enhance its usability. RoHS compliant and with a high dielectric withstanding voltage of 1000V AC, the Z-PACK Future Bus+ is a reliable and versatile choice for demanding PCB connectivity needs.
