Enhance your PCB connectivity with the Z-PACK Future Bus+ Board-to-Board Connector, designed for high-performance signal transmission. With a rugged housing crafted from LCP (Liquid Crystal Polymer) in a natural color, this connector ensures durability and reliability in demanding environments. Featuring four rows of 192 phosphor bronze contacts with gold plating, it guarantees efficient power and data transfer with an impedance of 192 Ω. Operating at temperatures ranging from -67 to 257 °F, it is suitable for a wide range of applications. The vertical mount orientation, along with polarization for mating alignment, facilitates easy installation. Compliant with UL 94V-0 standards and offering a contact amperage of 5 A, this connector prioritizes safety and performance. Ideal for signal circuit applications, it is perfect for use in various industries. With a tube packaging containing six units, it is convenient and cost-effective for bulk requirements. Upgrade your connectivity solutions with this advanced board-to-board connector for seamless and efficient PCB integration.
