787170-7
68 50SR R/A RCPT ASSY,REDESIGN
Enhance connectivity with our AMPLIMITE 0.50 Series D-Sub Receptacle, meticulously engineered for high-performance applications. Featuring a robust thermoplastic housing and UL-certified for safety and reliability, this connector boasts 68 gold-plated contacts for optimal signal transmission. Suitable for board mount installation through soldering, it offers a pitch of 1.27 mm and a standard profile. The full metal shell ensures durability, making it ideal for industrial environments. RoHS compliant, it meets stringent environmental standards. Upgrade your connectivity solutions with this versatile and efficient D-Sub connector.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 787170-7 |
Series: | AMPLIMITE 0.50 Series |
Amperage: | 1 A |
Gender: | Receptacle |
Housing Material: | Thermoplastic |
Number of Contacts: | 68 |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Solder |
Contact Material: | Phosphor Bronze |
Contact Plating: | Gold, Gold Flash over Palladium Nickel |
Pitch: | 1.27 mm |
Terminal Type: | Solder |
Number of Positions: | 68 |
Profile: | Standard |
Packaging: | Tube |
Shell Type: | Full Metal Shell |
Standards Met: | UL E28476 ;UL 94V-0 |
SKU: | AMP787170-7 |
Shell Material: | Carbon Steel |
Shell Plating Material: | Nickel over Copper |
Bracket Plating Material: | Nickel over Copper |
Shell Plating Finish: | Bright |
Bracket Material: | Zinc |
Post Plating Material: | Tin-Lead over Nickel |
Post Size: | .034 in |
PCB Mount Orientation: | Right Angle |
Contact Mating Area Plating Thickness: | 30 µin |
PCB Contact Termination Area Plating Material: | Tin-Lead |
Contact Base Material: | Phosphor Bronze |
PCB Thickness (Recommended): | .062 in / 1.57 mm |
Centerline (Pitch): | .05 in / 1.27 mm |
Housing Material: | Thermoplastic |
Housing Color: | Black |
Approved Standards: | UL E28476 |
UL Flammability Rating: | UL 94V-0 |
PCB Mounting Style: | Through Hole - Solder |
Boardlock Plating Material: | Tin-Lead over Nickel |
Connector Mounting Type: | Board Mount |
PCB Mount Alignment: | Without |
Mating Connector Lock: | Without |
PCB Mount Retention Type: | Boardlock |
Montageausrichtung der Leiterplatte: | Without |
PCB Mount Retention: | With |
Mating Alignment: | Without |
Mating Retention: | Without |
Mounting Hole Diameter: | .109 in |
Boardlock Material: | Copper Alloy |
Circuit Application: | Signal |
Row-to-Row Spacing: | .1 in / 2.54 mm |
Sealable: | No |
Connector Type: | Connector Assembly |
Shielded: | Yes |
Connector and Contact Terminates To: | Printed Circuit Board |
Connector System: | Cable-to-Board |
Product Type: | Connector |
Termination Post Length: | .1 in / 2.54 mm |
Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
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