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  5. Heilind Electronics Introduces JAE’s AC01 Series Board-to-Board Connectors

Heilind Electronics Introduces JAE’s AC01 Series Board-to-Board Connectors

AC01 Series SMT connectors from JAE Electronics feature a 0.5mm pitch and low profile design

WILMINGTON, Mass. (PRWEB) July 9, 2019 ― Heilind Electronics, a premier distributor of electronic components worldwide and the largest authorized distributor for JAE Electronics in North America, has recently added the manufacturer’s AC01 Series connectors to its extensive inventory of interconnect products.

The new connectors feature a 0.5mm contact pitch and 2.5mm to 3.0mm stacking height to accommodate today’s smaller and thinner applications. In addition, the connectors offer a highly stable and reliable contact structure that has been proven over decades of use.

Another benefit of AC01 Series connectors is their embossed tape packaging, designed for automated mounting during SMT production. This special packaging simplifies handling and provides higher mounting speeds in comparison to conventional tray packaging and hand assembly.

RoHS-compliant and with a variety of contact arrangement options, the AC01 series is a direct replacement of JAE’s older IL-312 Series 0.5mm pitch board-to-board connectors.

AC01 Series connectors can be used in a wide variety of electronic solutions in industries like datacom, telecommunications, factory automation and medical applications.

About Heilind Electronics
Heilind Electronics, Inc. is one of the world’s leading distributors of connectors, relays, sensors, switches, thermal management and circuit protection products, terminal blocks, wire and cable, wiring accessories and insulation and identification products. Founded in 1974, Heilind has locations throughout the U.S., Canada, Mexico, Brazil, Germany, Singapore, Hong Kong and China.

About JAE Electronics
JAE Electronics is a global leader in the design and manufacture of connectors, user interface devices and aviation electronics. It is recognized for its innovative technologies in developing fine pitch board-to-board, board-to-cable, FPC, memory card, input/output, circular, automotive/transportation, energy storage and waterproof connectors.

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