Boyd Heatsinks
Over several decades, Boyd has built the world’s largest portfolio of heat sinks and thermal management technologies. Choosing the correct heat sink is essential to optimized cooling, with higher performance in more compact geometries at the correct price point. Choosing Boyd will help make your design the coolest on the market.
Stamped Board Level Heatsink
Board level heat sinks can be stamped or extruded. Stamped Heat Sinks are a cost-effective solution that add surface area to increase heat transfer for board level products. Stamped heat sinks are made with sheet metal that has gone through a progressive punching process where details and features are added with each stamp of metal going through the punching die.
Stamped heat sink geometries are designed for specific electronic package types to ensure optimized fit and function on a PCB. These heat sinks can be passive or active based on the addition of a fan which is typically used to increase air flow across the entire board or system. These heat sinks come in a variety of mounting methods, including solder tabs and pins, interference fit with the device through integrated clips or slide-on features, or through-hole hardware like screws and nuts. Most Stamped Heat Sinks are available with a finish to improve heat radiation and thermal performance for natural convection applications.
- Ideal for Lower Power Applications
- Options for Fast & Easy Assembly
- Low Cost
- Scalable High Volume
- Catalog Options for all package type
Other Features
- Perfect for applications 5W or less
- For compact applications, no larger than 50mm
- Should be used for one device
Height Range: 10mm – 50mm
Material: Aluminum
Finish:
• Black or Clear Anodize or
• Tin-Plated
Approximate Thermal Resistance (°C/W):
• Natural Convection: ~8°C/W – 12°C/W
• Forced Convection: (20LFM – 1000LFM): ~2°C/W – 8°C/W
Heat Sink-to-Board mounting methods include:
• Solder Tabs & Pins
• Interference Fit with Integrated Clips or SlideOn Features
• Through-hole Hardware – Screws & Nuts
• Free-standing (sink mounted to component; component mounted to board)
• Epoxy-bonded
• Tape Attach
Dissipating component can be mounted to device by:
• Soldering
• Integrated spring clip
• Push-on spring clip
Zipper fin stacks are made from a series of individual stamped sheet metal fins that are folded and zipped together using interlocking features. Fin lengths and gaps vary based on the stamping die. Fins can be closed to create a finned duct or left open for multi-directional air flow based on application requirements. The fin stack is typically soldered, brazed, or epoxied to a heat sink base or heat pipes for a full thermal assembly. The joining of the fins at the top and bottom creates increased mechanical stability for more durable heat sinks.
Zipper fin stacks offer a high level of design flexibility that enables their use in highly integrated solutions with a range of technologies from embedded and transport heat pipes and vapor chambers to fans and larger systems.
Benefits
- High Thermal Performance
- Ideal for Forced Convection
- Easily Integrated, High Design Flexibility
- Lower Tooling Costs
- Lighter Weight
- Can be used to increase Heat Pipe Efficiency
- Increased Mechanical Integrity
Integrate Heat Sinks with More Boyd Thermal Technologies
While standalone heat sinks are suitable for many applications, heat sinks integrated with fans, heat pipes, or liquid cooling systems boost cooling capacity, enable customized design, streamline installation, and provide comprehensive thermal management for demanding applications. Boyd’s comprehensive thermal portfolio enables us to serve our customers with a best fit solution for their applications.
Downloadable Resources:
Heat Sink Frabrications Guide
Quick & Easy Guide to Choosing a Heat Sink
Shop Stamped Heatsinks
