170814-2008
NeoScale High-Speed Mezzanine Receptacle, 2.80mm Pitch, 6x12, 72 Triads (216 Circuits), 18.00mm Connector Height, 0.76?m Gold (Au) Plating
Part Aliases: Molex 1708142008
The NeoScale High-Speed Mezzanine Receptacle, a cutting-edge connectivity solution for your electronic projects. With a 2.80mm pitch and 216 circuits arranged in 6x12 triads, this receptacle ensures efficient signal transmission. Boasting a vertical orientation and 18.00mm connector height, it's designed for seamless integration on your PCB. The 0.76?m Gold (Au) plating guarantees reliable conductivity, while the High Performance Alloy (HPA) contact material ensures durability in extreme temperatures ranging from -55 to 85 °C. Suitable for high-speed applications, this black receptacle is RoHS compliant and lead-free process capable, making it a sustainable choice for your projects. Perfect for board-to-board connections, it offers secure solder or weld termination and features keying for error-free mating. Whether you're working on industrial machinery or consumer electronics, the NeoScale Receptacle delivers performance and longevity. Elevate your designs with this essential component.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 170814-2008 |
Color: | Black |
Series: | 170814 - NeoScale |
Amperage: | 1 A |
Connector Type: | NeoScale |
Number of Contacts: | 216 |
Number of Rows: | 6 |
Termination Method: | Solder or Weld |
Contact Material: | High Performance Alloy (HPA) |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -55 °C |
Pitch: | 2.8 mm |
Voltage: | 30 V AC/DC |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Keying: | Yes |
Tail Length: | 1.3 mm |
Packaging: | Tray |
Operating Temperature Range: | -55 - 85 °C |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Ground to Panel / PCB: | No |
Number of Contacts Loaded: | 216 |
Mating Cycles: | 100 |
PCB Locator: | Yes |
PCB Retention: | With |
Polarized to PCB: | Yes |
Polarized to Mate: | Yes |
Supplier Product Group: | PCB Socket Receptacles |
Connector System: | Board to Board |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 020 |
Max. Cycles at Max. Process Temperature: | 001 |
Electrical Model: | No |
Glow Wire Capable: | No |
Guide to Mating Part: | Yes |
Lock to Mating Part: | No |
Part Aliases: | 1708142008 |
SKU: | MOL170814-2008 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
04/30/2021 | 509969 - Capacity change or tool replacement. molex is developing additional capacity 3 insertion molding pockets from 16 cavities to 32 cavities. this is to support current market demand ramp up. | Download |