171722-2002

zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-2, Connector and Cage with EMI Spring Finger, 152 Circuit, Gold (Au) Over Nickel Plated, Up/Down Light Pipe

Part Aliases: Molex 1717222002  
Introducing the zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-2 Connector and Cage, a high-performance solution for your connectivity needs. This innovative assembly features 152 gold-plated contacts for reliable data transfer, with a right-angle orientation and EMI spring finger for enhanced signal integrity. Designed for through-hole termination, it offers secure PCB mounting with features like PCB locator and retention. Operating in a wide temperature range from -40 to 85°C, and certified for RoHS compliance, this connector is both durable and environmentally friendly. Ideal for high-speed applications, it is suitable for board-to-board, wire-to-board, and module-to-board connections. Upgrade your connectivity with this cutting-edge solution.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: Molex 171722-2002
Color: Black
Series: 171722 - zQSFP Plus - zQSFP
Amperage: .5 A
Connector Type: zQSFP Plus
Number of Contacts: 152
Number of Rows: 2
Termination Method: Through Hole - Compliant Pin
Contact Material: Copper Alloy
Contact Plating: Gold over Nickel
Body Orientation: Right Angle
Pitch: .8 mm
Voltage: 30 V AC/DC
Shield Type: EMI Fingers
Material: Thermoplastic
Number of Ports: 4
Orientation: Right Angle
Keying: No
Component Type: Receptacle
Tail Length: 1.2 mm
Packaging: Tray
Operating Temperature Range: -40 - 85 °C
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .762 µm
Ground to Panel / PCB: Yes
Number of Contacts Loaded: 152
Mating Cycles: 100
PCB Locator: Yes
PCB Retention: Yes
Polarized to PCB: Yes
Contact Termination Plating Thickness: .762 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 1.57 mm
Supplier Product Group: High Speed Cage & Connector Assemblies
Connector System: Board to Board, Module to Board, Wire to Board
UL Agency Certification: E29179
Contact Termination Plating: Matte Tin
Electrical Model: Yes
Lock to Mating Part: Yes
Surface Mount Compatible: No
Material Flammability Standard: 94V-0
Part Aliases: 1717222002
SKU: MOL171722-2002

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
03/30/2023 512624 - Packaging Method/Quantity Changing. This notification is to inform you about Molex will change packing method. Remove box in box. it is only
package improvement, SPQ & MOQ are same ,no any change to product dimension, function and fit
Download
11/09/2020 509372- Capacity change or tool replacement. Notice of capacity expansion for zQSFP by duplication current sub module ASSY line. date code format: LDD0X range from 314 onwards. Download
10/29/2020 509555 - Retraction of Obsolete status. Molex has revised the decision to obsolete selected part numbers as previously announced Download
03/01/2019 506285 - Capacity Change or Tool Replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. Download
09/01/2018 505678 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. Download
10/03/2016 501582 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. Download
04/29/2016 500741 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. Download
01/01/2016 GCM 10730795 - New, Modified, Or Replacement Tooling. Molex is buildling 2 new molds for better production capacity of the Lightpipe and housing component used in zQSFP+ connector. The gating point of the housing new mold will be different from the current mold as shown. Both new molds will be used in production at Molex Singapore Plant. This change will not affect Form, Fit, or Function of the product. The new molds will be internally qualified before using for mass production. Products made in or after Jan 16 will contain components from the new mold. Download
12/01/2015 GCM 10724605 - Supplier Changes To Raw Material. This letter is to informed you that there is a change in manufacturing location from Malaysia to China for plastic resin used in the products listed in the attachment initiated by the plastic resin maker. There is no impact to the product form, fit and function as the raw plastic resin material composition remains unchanged. Brand name is changed as well from Vectra to LAPEROS. Download