171813-0006
3.96mm Pitch, KK 396 RPC Vertical Header with Friction Lock, Tin (Sn) Plating, Pin Length 17.02mm, Bag, 6 Circuits
Part Aliases: Molex 1718130006
Enhance your circuit connections with this black KK 396 series straight pin header. Featuring a 3.96mm pitch, this high-quality connector offers 6 contacts for reliable signal transmission. With a voltage rating of 250V and amperage options of 5A and 7A, it is suitable for various applications. The through-hole termination method ensures secure PCB attachment, while the vertical orientation allows for space-efficient mounting. Made of high-temperature thermoplastic with matte tin plating, it guarantees durability and efficient signal transfer. RoHS compliant and UL certified, this connector meets international standards for quality and safety. Perfect for board-to-board or wire-to-board connections, it is a versatile component for your electronic projects.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171813-0006 |
| Color: | Black |
| Series: | 171813 - KK 396 |
| Amperage: | 5 A, 7 A |
| Connector Type: | KK 396 |
| Number of Contacts: | 6 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3.96 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Packaging: | Bag |
| Operating Temperature Range: | -40 - 105 °C, -40 - 80 °C |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 1.524 µm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 1.524 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Matte Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Partial |
| Material Flammability Standard: | 94V-1 94V-2 |
| Part Aliases: | 1718130006 |
| SKU: | MOL171813-0006 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Product Change Notice Download |
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Product Change Notice Download |
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Product Change Notice Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Product Change Notice Download |
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Product Change Notice Download |
| 09/30/2016 | 500745 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Product Change Notice Download |