172065-0306
Mega-Fit Slim Vertical Header, Through Hole, 5.70mm Pitch, Dual Row, 6 Circuits, 0.76
Introducing the Mega-Fit Slim Vertical Header, a high-performance connector designed for through-hole mounting with a 5.70mm pitch. Featuring a dual-row configuration and 6 circuits, this header ensures reliable power and signal transmission in demanding applications. With a straight body orientation and vertical mating type, it offers versatility in PCB layouts. Constructed with high-conductivity copper contacts and liquid crystal polymer material, it guarantees optimal performance in a wide range of operating temperatures (-40 to 120 °C). Gold plating on the contact mating area enhances conductivity, while matte tin termination provides durable solder connections. Meeting RoHS compliance and Glow Wire Capable standards, this connector is both environmentally friendly and safe for use. Ideal for wire-to-board connections, it offers a secure mating experience with locking features and PCB retention. With a compact design and surface-mount compatibility, the Mega-Fit Slim Vertical Header is the perfect solution for space-constrained applications requiring high current (23A) and voltage (600V AC/DC) capabilities.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 172065-0306 |
| Color: | Black |
| Series: | 172065 - Mega-Fit |
| Amperage: | 23 A |
| Connector Type: | Mega-Fit |
| Number of Contacts: | 6 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | High Conductivity Copper |
| Body Orientation: | Straight |
| Pitch: | 5.7 mm |
| Voltage: | 600 V AC/DC |
| Material: | Liquid Crystal Polymer |
| Orientation: | Vertical |
| Keying: | Yes |
| Tail Length: | 3.73 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 120 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.58 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Matte Tin |
| Termination Pitch: | 5.7 mm |
| Glow Wire Capable: | Yes |
| Lock to Mating Part: | Yes |
| Mated Height: | 16.78 mm |
| Surface Mount Compatible: | Yes |
| Unmated Height: | 14.8 mm |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Yes |
| Product Name: | Mega-Fit |
| Part Aliases: | 1720650306 |
| SKU: | MOL172065-0306 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/28/2022 | 511200 - Change Supplier. Supplier change from Polyplastics to WOTE and resin LCP 30% GF BLACK UL94V-0 unchanged Reason:Polyplastics don't give Molex Shanghai any volume in CY22 Q2 due to capacity shortage, we need to qualify local LCP supplier Wote to meet ramp-up demand Impact: Resin 899920212 (POLYPLASTICS - LAPEROS E130I - BLACK) Implement change: Validation of supplier change | Download |
| 01/24/2022 | 510412 - Change Supplier. a second source material supplier is being added to ensure ability to provide for current and future demand. | Download |
| 04/30/2019 | 506820 - Manufacturing Process Change (Molex). The manufacturing process for the part(s) identified in this notice are changing. |
Download |
| 07/20/2018 | 505659 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download |