173112-0039
FCT High Power Contact, Female, Straight, Solder Cup, 0.10µm Gold over Nickel Phosphorus Plating (Mating), 5.00µm Tin Plating (Terminating), 16-20 AWG
Part Aliases: Molex 1731120039 Molex FMP005S203
Enhance your power connections with our FCT High Power Contact, designed for optimal performance. This female contact features a straight orientation and a durable solder cup termination method, ensuring secure and reliable connections. With 0.10µm Gold over Nickel Phosphorus plating for mating and 5.00µm Tin plating for terminating, it offers excellent conductivity and corrosion resistance. Suitable for 16-20 AWG wire sizes, it can handle up to 10 A of current, making it ideal for high-power applications. Operating in a wide temperature range from -55 to 155 °C, it guarantees reliable performance in various environments. With a copper alloy construction and gold plating, it ensures durability and longevity, with 500 mating cycles. Compliant with RoHS regulations, this high-quality connector is a perfect choice for your industrial needs. Explore our FCT Products range for more connectors and accessories to complete your setup.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 173112-0039 |
Series: | 173112 |
Amperage: | 10 A |
Gender: | Female |
Termination Method: | Solder Cup |
Contact Material: | Copper Alloy |
Contact Plating: | Gold over Nickel Phosphorus |
Contact Type: | High Power |
Orientation: | Straight |
Operating Temperature Range: | -55 - 155 °C |
Contact Mating Area Plating Thickness: | .1 µm |
Mating Cycles: | 500 |
Type: | Mixed Layout |
Contact Termination Plating Thickness: | 5 µm |
Wire Size: | 16 AWG, 18 AWG, 20 AWG |
Retainer Clip Material: | Copper Alloy |
Product Name: | FCT Products |
Part Aliases: | 1731120039 FMP005S203 |
SKU: | MOL173112-0039 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download |