173112-0154
FCT High Power Contact, Male, Straight, PCB Through Hole, 0.10µm Gold over Nickel Phosphorus Plating, 20.0A, 3.15mm PCB Drilling Diameter
Part Aliases: Molex 1731120154 Molex FMP010P203
Introducing our high-power FCT Contact for male connectors, designed for seamless integration in PCB applications. Featuring a straight orientation and through-hole termination, this contact ensures reliable connectivity. With a robust construction of copper alloy and 0.10µm Gold over Nickel Phosphorus plating, it offers enhanced durability and conductivity, making it ideal for high-power transmission. The contact can handle a maximum amperage of 20A, with a 3.15mm PCB drilling diameter. Operating efficiently in a wide temperature range from -55 to 155°C, it is suitable for versatile industrial applications. With a mating cycle of 500, this contact guarantees long-term performance. Compliant with RoHS standards, it is part of our FCT Products range, known for quality and reliability in the field of connectors. Perfect for use in D-Sub and D-Ribbon connectors, this contact is a crucial component for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 173112-0154 |
| Series: | 173112 |
| Amperage: | 20 A |
| Gender: | Male |
| Termination Method: | Through Hole |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel Phosphorus |
| Contact Type: | High Power |
| Orientation: | Straight |
| Operating Temperature Range: | -55 - 155 °C |
| Contact Mating Area Plating Thickness: | .1 µm |
| Mating Cycles: | 500 |
| Type: | Mixed Layout |
| Contact Termination Plating Thickness: | 5 µm |
| Retainer Clip Material: | Copper Alloy |
| Product Name: | FCT Products |
| Part Aliases: | 1731120154 FMP010P203 |
| SKU: | MOL173112-0154 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download |