173112-0157
FCT High Power Contact, Female, Straight, PCB Through Hole, 0.10µm Gold over Nickel Phosphorus Plating, 20.0A, 2.90mm PCB Drilling Diameter
Part Aliases: Molex 1731120157 Molex FMP010S203
Enhance your PCB connectivity with our FCT High Power Contact, designed for seamless integration in high-performance applications. This female contact features a straight orientation and through-hole termination method, ensuring secure and reliable connections. With a contact material of Copper Alloy and 0.10µm Gold over Nickel Phosphorus plating, it offers superior conductivity and durability. Operating flawlessly in a wide temperature range from -55 to 155 °C, it is ideal for use in diverse environments. Capable of handling up to 20A of current, this contact is perfect for demanding power transmission requirements. Its 2.90mm PCB drilling diameter and mixed layout compatibility make it versatile for various setups. With a mating cycle of 500, it guarantees long-lasting performance. Rest assured of its quality and compliance with RoHS standards. Elevate your connectivity solutions with FCT Products.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 173112-0157 |
| Series: | 173112 |
| Amperage: | 20 A |
| Gender: | Female |
| Termination Method: | Through Hole |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel Phosphorus |
| Contact Type: | High Power |
| Orientation: | Straight |
| Operating Temperature Range: | -55 - 155 °C |
| Contact Mating Area Plating Thickness: | .1 µm |
| Mating Cycles: | 500 |
| Type: | Mixed Layout |
| Contact Termination Plating Thickness: | 5 µm |
| Retainer Clip Material: | Copper Alloy |
| Product Name: | FCT Products |
| Part Aliases: | 1731120157 FMP010S203 |
| SKU: | MOL173112-0157 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download |