207776-0002

Squba 3.6 Plug Terminal, Matte Tin Plating, UL1007/UL1061 Compatible, 20-18 AWG, Reel

Part Aliases: Molex 2077760002  
The Squba 3.6 Plug Terminal, a high-performance solution for your connectivity needs. With matte tin plating, this male terminal is designed for optimal conductivity, accommodating wire sizes ranging from 18 to 20 AWG. Operating at an amperage of 11.5 A and a voltage of 600 V, it is suitable for both signal and power applications. Featuring copper alloy contact material and a durable construction, it ensures reliable performance even in demanding environments. The crimp or compression termination method offers easy installation, while the matte tin plating on the contact mating area guarantees long-lasting durability. Perfect for wire-to-wire connections, this terminal is part of the Squba series, known for its quality and precision. Compliant with RoHS regulations, it meets the highest standards of environmental responsibility. Elevate your connectivity experience with the Squba 3.6 Plug Terminal.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 207776-0002
Series:207776 - Squba
Amperage:11.5 A
Connector Type:Squba
Gender:Male
Termination Method:Crimp or Compression
Contact Material:Copper Alloy
Voltage:600 V
Circuit Application:Power, Signal
Contact Mating Area Plating:Matte Tin
Contact Mating Area Plating Thickness:2.54 µm
Mating Cycles:25
Contact Termination Plating Thickness:2.540 µm
Wire Size:18 AWG, 20 AWG
Connector System:Wire to Wire
Contact Termination Plating:Matte Tin
Wire Insulation Diameter:1.46 mm - 2.1 mm
Part Aliases:2077760002
SKU:MOL207776-0002

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
03/01/2021509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)Download