207776-0002
Squba 3.6 Plug Terminal, Matte Tin Plating, 18-20 AWG, Reel
Introducing the Squba 3.6 Plug Terminal, a high-performance solution for your connectivity needs. With matte tin plating, this male terminal is designed for optimal conductivity, accommodating wire sizes ranging from 18 to 20 AWG. Operating at an amperage of 11.5 A and a voltage of 600 V, it is suitable for both signal and power applications. Featuring copper alloy contact material and a durable construction, it ensures reliable performance even in demanding environments. The crimp or compression termination method offers easy installation, while the matte tin plating on the contact mating area guarantees long-lasting durability. Perfect for wire-to-wire connections, this terminal is part of the Squba series, known for its quality and precision. Compliant with RoHS regulations, it meets the highest standards of environmental responsibility. Elevate your connectivity experience with the Squba 3.6 Plug Terminal.
| Product Category: | |
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 207776-0002 |
| Series: | 207776 - Squba |
| Amperage: | 11.5 A |
| Connector Type: | Squba |
| Gender: | Male |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Voltage: | 600 V |
| Packaging: | Reel |
| Circuit Application: | Power, Signal |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Mating Cycles: | 25 |
| Contact Termination Plating Thickness: | 2.540 µm |
| Wire Size: | 18 AWG, 20 AWG |
| Connector System: | Wire to Wire |
| Contact Termination Plating: | Matte Tin |
| Wire Insulation Diameter: | 1.46 mm - 2.1 mm |
| Part Aliases: | 2077760002 |
| SKU: | MOL207776-0002 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
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| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |