207777-0002
Squba 3.6 Receptacle Terminal, Matte Tin Plating, 18-20 AWG, Reel
The Squba 3.6 Receptacle Terminal offers reliable connectivity for your applications. With matte tin plating and a copper alloy contact material, it ensures efficient power and signal transmission. Designed for 18-20 AWG wire sizes, it can handle up to 11.5 A of current and 600 V of voltage. The crimp or compression termination method makes installation easy, while its durable construction allows for 25 mating cycles. Perfect for wire-to-wire connections in various settings, this connector is RoHS compliant, meeting environmental standards. Upgrade your connectivity with the Squba Sealed Wire-to-Wire Connectors.
| Product Category: | |
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 207777-0002 |
| Series: | 207777 - Squba |
| Amperage: | 11.5 A |
| Connector Type: | Squba |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Voltage: | 600 V |
| Packaging: | Reel |
| Circuit Application: | Power, Signal |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Mating Cycles: | 25 |
| Contact Termination Plating Thickness: | 2.540 µm |
| Wire Size: | 18 AWG, 20 AWG |
| Connector System: | Wire to Wire |
| Contact Termination Plating: | Matte Tin |
| Wire Insulation Diameter: | 1.46 mm - 2.1 mm |
| Part Aliases: | 2077770002 |
| SKU: | MOL207777-0002 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/15/2022 | 511722 - Equipment/production transfer or rearrangement. This notification is to inform you about equipment transfer that have been used to manufacture impacted part(s). Equipment have been moved to different site/ location/ premises. No changes will be made to product as part of this change. |
Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |