207777-0002

Squba 3.6 Receptacle Terminal, Matte Tin Plating, UL1007/UL1061 Compatible, 20-18 AWG, Reel

Part Aliases: Molex 2077770002  
The Squba 3.6 Receptacle Terminal offers reliable connectivity for your applications. With matte tin plating and a copper alloy contact material, it ensures efficient power and signal transmission. Designed for 18-20 AWG wire sizes, it can handle up to 11.5 A of current and 600 V of voltage. The crimp or compression termination method makes installation easy, while its durable construction allows for 25 mating cycles. Perfect for wire-to-wire connections in various settings, this connector is RoHS compliant, meeting environmental standards. Upgrade your connectivity with the Squba Sealed Wire-to-Wire Connectors.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 207777-0002
Series:207777 - Squba
Amperage:11.5 A
Connector Type:Squba
Gender:Female
Termination Method:Crimp or Compression
Contact Material:Copper Alloy
Voltage:600 V
Circuit Application:Power, Signal
Contact Mating Area Plating:Matte Tin
Contact Mating Area Plating Thickness:2.54 µm
Mating Cycles:25
Contact Termination Plating Thickness:2.540 µm
Wire Size:18 AWG, 20 AWG
Connector System:Wire to Wire
Contact Termination Plating:Matte Tin
Wire Insulation Diameter:1.46 mm - 2.1 mm
Part Aliases:2077770002
SKU:MOL207777-0002

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
03/15/2022511722 - Equipment/production transfer or rearrangement. This notification is to inform you about equipment transfer that have been used to manufacture impacted part(s). Equipment have been moved to different site/ location/ premises. No changes will be made to product as part of this change.
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03/01/2021509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)Download