44764-1203
Micro-Fit BMI Receptacle Header, Dual Row, Right-Angle, with Press-fit Plastic Pegs, 0.80?m Gold (Au) Selective, 12 Circuits
Part Aliases: Molex 0447641203
Enhance your power connectivity with the Micro-Fit BMI Receptacle Header, featuring a dual-row, right-angle design for efficient PCB integration. With press-fit plastic pegs for secure mounting, this header ensures reliable performance in high-vibration environments. Its 0.80μm Gold (Au) selective plating offers excellent conductivity, ideal for power applications. With 12 circuits, 8.5A amperage, and 600V voltage rating, it meets demanding power transmission needs. The phosphor bronze contacts and tin termination provide durability and solderability. Operating within a wide temperature range (-40 to 105°C) and capable of 30 mating cycles, this header is a dependable choice for your design. RoHS compliant and UL recognized, it guarantees quality and safety assurance. Perfect for board-to-board or wire-to-board connections, the Micro-Fit BMI Receptacle Header is a versatile solution for your connectivity requirements.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44764-1203 |
| Series: | 44764 - Micro-Fit BMI |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit BMI |
| Number of Contacts: | 12 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Orientation: | Right Angle |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 12 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | With |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.54 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | No |
| Product Name: | Micro-Fit BMI |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0447641203 |
| SKU: | MOL44764-1203 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/11/2022 | 512815 - Change Supplier. This notification is to inform you that one of Molex’s long standing North American supplier of Trays and Lids is filing for bankruptcy causing Molex to have to change our supplier source in order to continue to provide product to our customers. This will be a packaging supplier change only. There will be no change to the Production Process, Fit, Form or Function of the product packaged in these trays and lids. | Download |
| 02/23/2015 | GCM 10649385 - New, Modified, Or Replacement Tooling. | Download |