44764-1802
Micro-Fit BMI Receptacle Header, Dual Row, Right-Angle, with Press-fit Plastic Pegs, 0.38?m Gold (Au) Selective, 18 Circuits
Part Aliases: Molex 0447641802
Introducing the Micro-Fit BMI Receptacle Header, a versatile connectivity solution designed for power applications. This dual-row header features a right-angle orientation with press-fit plastic pegs for secure mounting. With 18 gold-plated (Au) contacts, it ensures reliable signal transmission with a current rating of 8.5 A and voltage capability of 600 V. The through-hole termination method and phosphor bronze contact material guarantee durability and stability in operation. Suitable for board-to-board and wire-to-board connections, this header is UL and CSA certified, meeting industry standards for quality and safety. Its compact design, with a pitch of 3 mm and operating temperature range of -40 to 105 °C, makes it ideal for various electronic applications. RoHS compliant, lead-free, and with a high-temperature solder process capability, the Micro-Fit BMI Receptacle Header is a dependable choice for your PCB connector needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44764-1802 |
| Series: | 44764 - Micro-Fit BMI |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit BMI |
| Number of Contacts: | 18 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Orientation: | Right Angle |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 18 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | With |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.54 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | No |
| Product Name: | Micro-Fit BMI |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0447641802 |
| SKU: | MOL44764-1802 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/11/2022 | 512815 - Change Supplier. This notification is to inform you that one of Molex’s long standing North American supplier of Trays and Lids is filing for bankruptcy causing Molex to have to change our supplier source in order to continue to provide product to our customers. This will be a packaging supplier change only. There will be no change to the Production Process, Fit, Form or Function of the product packaged in these trays and lids. | Download |
| 09/30/2019 | 505980 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function. | Download |
| 02/23/2015 | GCM 10649385 - New, Modified, Or Replacement Tooling. | Download |