44764-2001
Micro-Fit BMI Receptacle Header, Dual Row, Right-Angle, with Press-fit Plastic Pegs, 2.54?m Tin (Sn), 20 Circuits
Part Aliases: Molex 0447642001
Experience efficient power connectivity with our Micro-Fit BMI Receptacle Header, featuring a dual-row design for enhanced functionality. This right-angle connector comes with press-fit plastic pegs for secure installation, ensuring reliable performance in your PCB assembly. With 20 circuits and a current rating of 8.5 A, it's perfect for power transmission applications. The phosphor bronze contacts plated with 2.54µm tin guarantee excellent conductivity, while the 600 V voltage rating offers ample protection. Operating in temperatures ranging from -40 to 105°C, this header is suitable for a wide range of environments. Whether for board-to-board or wire-to-board connections, its versatile design meets various connectivity needs. RoHS compliant and UL certified, you can trust in its quality and compliance with industry standards. Upgrade your electronic assemblies with our Micro-Fit BMI Receptacle Header for reliable and efficient power distribution.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44764-2001 |
| Series: | 44764 - Micro-Fit BMI |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit BMI |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Orientation: | Right Angle |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 1.016 µm |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | With |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 1.016 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | No |
| Product Name: | Micro-Fit BMI |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0447642001 |
| SKU: | MOL44764-2001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/11/2022 | 512815 - Change Supplier. This notification is to inform you that one of Molex’s long standing North American supplier of Trays and Lids is filing for bankruptcy causing Molex to have to change our supplier source in order to continue to provide product to our customers. This will be a packaging supplier change only. There will be no change to the Production Process, Fit, Form or Function of the product packaged in these trays and lids. | Download |
| 02/23/2015 | GCM 10649385 - New, Modified, Or Replacement Tooling. | Download |