44764-2003
Micro-Fit BMI Receptacle Header, Dual Row, Right-Angle, with Press-fit Plastic Pegs, 0.80?m Gold (Au) Selective, 20 Circuits
Part Aliases: Molex 0447642003
Enhance your connectivity with our Micro-Fit BMI Receptacle Header, featuring a dual-row design for optimal performance. This right-angle header comes equipped with press-fit plastic pegs and boasts a selective 0.80µm gold (Au) plating, ensuring both durability and reliable conductivity. With 20 circuits, it offers ample connectivity options, while its 8.5A amperage and 600V voltage rating make it ideal for power applications. The phosphor bronze contacts and tin termination provide excellent signal transmission, even in demanding environments. RoHS compliant and capable of withstanding temperatures ranging from -40 to 105°C, this header is a versatile and dependable choice for your PCB connectivity needs. Whether for board-to-board or wire-to-board connections, trust in the Micro-Fit BMI series for efficient and secure interconnections.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44764-2003 |
| Series: | 44764 - Micro-Fit BMI |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit BMI |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Orientation: | Right Angle |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | With |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.54 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | No |
| Product Name: | Micro-Fit BMI |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0447642003 |
| SKU: | MOL44764-2003 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/11/2022 | 512815 - Change Supplier. This notification is to inform you that one of Molex’s long standing North American supplier of Trays and Lids is filing for bankruptcy causing Molex to have to change our supplier source in order to continue to provide product to our customers. This will be a packaging supplier change only. There will be no change to the Production Process, Fit, Form or Function of the product packaged in these trays and lids. | Download |
| 02/23/2015 | GCM 10649385 - New, Modified, Or Replacement Tooling. | Download |