87832-3221
Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead-Free, 32 Circuits, 0.76
Part Aliases: Molex 0878323221
Easily integrate connectivity solutions with this straight-orientation Milli-Grid Header, designed for surface-mount applications. Featuring a shrouded design for added protection, this lead-free connector is ideal for vertical mounting in electronics assemblies. With 32 gold-plated contacts on a 2mm pitch, it ensures reliable signal transmission in a compact form factor. Constructed with durable materials like Phosphor Bronze and Nylon, it meets stringent operating temperature and flammability standards. Certified by CSA and UL, it guarantees quality and safety in wire-to-board connections. Designed for longevity, it can withstand multiple mating cycles and high solder process temperatures. Fully RoHS-compliant, it aligns with environmental regulations, making it a sustainable choice for PCB assembly. Whether for industrial or consumer electronics, this Milli-Grid Header offers a versatile and dependable solution for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 87832-3221 |
| Color: | Black |
| Series: | 87832 - Milli-Grid |
| Amperage: | 2 A |
| Connector Type: | Milli-Grid |
| Number of Contacts: | 32 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 2 mm |
| Voltage: | 125 V |
| Material: | Nylon |
| Orientation: | Vertical |
| Keying: | Yes |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 32 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 1.905 µm |
| Connector System: | Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 2 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0878323221 |
| SKU: | MOL87832-3221 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 02/15/2022 | 511416 - Capacity change or tool replacement. Molex is adding New Capacity assembly line to accommodate milligrid 87832 series no impact to fit form or function | Download |
| 02/24/2014 | GCM 10623991 - New, Modified, Or Replacement Tooling. | Download |