1648382-1
708-68-01109=CONTACT,SKT,#20
Part Aliases: TE Connectivity 708-68-01109
Enhance your power connectivity with the ELCON Drawer Contact for Board Mount applications. Featuring a durable Copper construction with Gold plating, this Socket contact ensures reliable performance in demanding environments. With a current rating of 5 A and a contact size of 20, it is perfect for power circuit applications. The contact is designed for Through Hole - Solder termination on PCBs, providing secure and stable connections. Operating within a wide temperature range of -55 to 105 °C (-67 to 221 °F), it is suitable for various industrial settings. Each package contains 1000 contacts, meeting your bulk connectivity needs with ease. Stay compliant with RoHS regulations while benefiting from the high-quality construction and performance of this essential component. Perfect for Wire to Board connectors, it facilitates efficient power transmission in your electronic systems. Upgrade your connectivity solutions with this Contact, designed for optimal performance and durability.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1648382-1 |
| Series: | ELCON Drawer |
| Accessory Type: | Contact |
| Mount Type: | Board Mount, Through Hole - Solder |
| Contact Material: | Copper |
| Contact Plating: | Gold |
| Contact Size: | 20 |
| Contact Type: | Socket |
| Package Quantity: | 1000 |
| Contact Amperage: | 5 A |
| Termination Type: | PCB (Standard) |
| GPL: | G65 |
| Packaging: | Bag |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| Contact Termination Plating Thickness: | 10 µin, .25 µm |
| Contact Underplating Material: | Nickel |
| GPL Description: | Data and Devices |
| Product Code: | H848 |
| Wire Size: | 20 - 24 AWG |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Gold |
| ECCN: | EAR99 |
| Contact Underplating Thickness: | 1 µm, 40 µin |
| Wire Insulation Support: | Without |
| Contact Retention: | Without |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Orientation: | Straight |
| Wire Contact Termination Area Plating Material: | Gold |
| Crimp Area Plating Finish: | Gold |
| Crimp Area Plating Thickness: | 10 µin, .25 µm |
| Contact Product Type: | Contact |
| Part Aliases: | 708-68-01109 1648382-1 |
| SKU: | AMP1648382-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |