Enhance your high-speed data transmission capabilities with this QSFP+ Assembly. Featuring a compact 2x1 configuration, it ensures efficient board mounting with a termination method of Through Hole - Press-Fit. With a data rate of 14 Gb/s, this assembly is ideal for standard applications, meeting UL 94V-0 material flammability standards for safety. Each package includes a Box & Tray for convenient storage, and the operating temperature range of -55 to 105°C ensures reliable performance in various environments. Gold plating on contact mating areas and printed circuit boards guarantees optimal signal conductivity, while the inclusion of an elastomeric gasket provides EMI and RFI protection. This assembly, compliant with RoHS standards, is a crucial component for modern connectivity solutions.
