2198230-3

SFP+ Enhanced 1x2, Networking Heatsink

Enhance your networking setup with our SFP+ 1x2 Networking Heatsink, designed for optimal performance in high-speed environments. This cage assembly features a Through Hole - Press-Fit termination method, ensuring secure connectivity for your devices. With a data rate of 16 Gb/s and a port matrix configuration of 1 x 2, it offers reliable transmission capabilities. Operating efficiently in a wide temperature range from -55 to 105 °C (-67 to 221 °F), this product is suitable for various environmental conditions. RoHS compliant and crafted for durability, it is a must-have component for high-speed connectors and components. Elevate your networking infrastructure with this essential device.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198230-3
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198230-3
Heat Sink Style:Pin
Heat Sink Height:9.1 mm / .358 in
Heat Sink Height Class:Short
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: