2198236-2

SFP+ Enhanced 1x6, SAN Heatsink, LP

Elevate your storage area network with our SFP+ Enhanced 1x6 Cage Assembly, featuring a low-profile design and efficient SAN Heatsink. With a data rate of 16 Gb/s and six ports arranged in a 1 x 6 configuration, this high-speed connector ensures seamless connectivity. Operating flawlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), it guarantees performance in diverse environments. Designed for easy installation with Through Hole - Press-Fit mounting, this RoHS-compliant product is a reliable choice for demanding applications. Upgrade your connectivity with this essential component.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198236-2
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198236-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
Lightpipe Style:Reduced Length
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: