Enhance your CFP2 setup with this essential hardware kit, designed for optimal performance at 25 Gb/s data rates. Featuring a sleek anodized finish, this 1x1 configuration ensures seamless connectivity in your port matrix setup. With a PCB thickness of 3mm and a height of 9.55mm, it's perfect for accommodating your high-speed requirements. The side-to-side airflow heat sink style guarantees efficient cooling, while RoHS compliance underscores our commitment to environmental responsibility. Upgrade with confidence, as this accessory is ECCN EAR99 certified, making it suitable for global use. Perfect for data and devices integration, this kit (product_code: L322) is a must-have for your connectivity solutions.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2274842-1
Accessory Type:Hardware Kit
Finish/Coating:Anodized
Data Rate:25 Gb/s
Interface:CFP2
GPL:J8B
Port Matrix Configuration:1 x 1
Packaging:Tray
PCB Thickness (Recommended):3 mm
Sealable:No
GPL Description:Data and Devices
Product Code:L322
Connector Product Type:Accessory
ECCN:EAR99
Height:.38 in, 9.55 mm
Heat Sink Style:Side-to-Side Air Flow
Cage Type:1x1
Part Aliases:2274842-1
SKU:AMP2274842-1

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: