Introducing our high-performance Board-to-Board Header, designed for seamless connectivity in signal transmission applications. With a compact pitch size of .8mm, this connector features a straight body orientation for easy installation. The gold-plated brass contacts ensure reliable conductivity, while the UL 94V-0 housing material guarantees safety and durability. Operating at a voltage of 100V AC, it's suitable for a wide range of electronics. With a total of 80 positions and a stackable design, it offers versatility in PCB assembly. Ideal for mezzanine and board stacking configurations, it meets RoHS compliance standards, making it an eco-friendly choice. Elevate your connectivity solutions with this precision-engineered connector.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5177986-3
Amperage:.5 A
Housing Material:Matte
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Brass
Contact Plating:Gold
Body Orientation:Straight
Pitch:.031 in, .8 mm
Voltage:100 V AC
Contact Type:Tab
Contact Amperage:.5 A
Number of Positions:80
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
GPL:313
Mating Entry Location:Top
Packaging:Tape & Reel
Operating Temperature Range:-40 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.2 µm, 8 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin
Connector Height:.197 in, 5 mm
Sealable:No
Reel Diameter:.5 in
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L051
Contact Layout:Inline
Connector System:Board to Board
Stackable:Yes
ECCN:EAR99
Dielectric Withstanding Voltage:500 V AC
Board to Board Configuration:Mezzanine
Contact Mating Area Plating Finish:Matte
PCB Contact Termination Area Plating Finish:Matte
Locating Post:.02 in, .5 mm
PCB Mount Alignment:With
PCB Mount Alignment Type:Positioning Bosses
Application Assembly Feature:Pick and Place Cover
Connector Assembly Type:PCB Mount Header
Stack Height:13 mm, 17 mm, .197 in, .354 in, .512 in, 5 mm, .669 in, 9 mm
PCB Contact Termination Area Plating Thickness:2 µm, 78.74 µin
Temperature Rating:High
Assembly Process Feature Material:Steel
Product:Board-to-Board Headers & Receptacles
Operating Voltage:100 VAC
Material Flammability Standard:UL 94V-0
Part Aliases:5177986-3
SKU:AMP5177986-3
Assembly Process Feature Material:Steel
Stackable:Yes
Board-to-Board Configuration:Parallel
PCB Contact Termination Area Plating Material:Tin
Contact Mating Area Plating Material Finish:Matte
PCB Contact Termination Area Plating Material Finish:Matte
Contact Mating Area Plating Material Thickness:.2 µm / 8 µin
Mating Tab Thickness:.2 mm / .008 in
Mating Tab Width:.4 mm / .016 in
Contact Layout:Inline
PCB Contact Termination Area Plating Material Thickness:2 µm / 78.74 µin
Connector Height:5 mm / .197 in
Insulation Resistance:2 MΩ
Dielectric Withstanding Voltage (Max):500 VAC
Housing Color:Natural
Mating Entry Location:Top
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
PCB Mount Retention:Without
PCB Mount Alignment:With
PCB Mount Alignment Type:Positioning Bosses
Locating Post Length:.5 mm / .02 in
Mating Alignment:With
Mating Alignment Type:Polarization
Circuit Application:Signal
Assembly Process Feature:Pick and Place Cover
Packaging Reel Diameter:.5 in
Connector & Contact Terminates To:Printed Circuit Board
Connector System:Board-to-Board
Sealable:No
PCB Connector Assembly Type:PCB Mount Header
Rectangular Termination Post & Tail Thickness:.2 mm / .008 in
Rectangular Termination Post & Tail Width:.25 mm / .01 in
Operating Temperature Range:-40 - 125 °C / -40 - 257 °F
Housing Temperature Rating:High

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
02/01/2024P-23-025527 - Streamline. We plan to transfer back existing assembly lines from a TE leased site in Qingdao high tech zone to TE s main campus in Qingdao for Data and Devices business unit. Target transfer schedule to be finished by the end of January 2024.
Product Change Notice Download
10/25/2021P-21-021630 - Manufacturing location change. Following Part Numbers will be transferred from TE AMP QD limited to TM AMP QD Ltd High-Tech Zone Branch.
Product Change Notice Download
04/30/2018E-17-004332 - Document Clarification. Change current detail plating information to performance based plating as per TE internal alignment requirement. And keep special plating thickness like 15 microinch , 30 microinch the same description.Product Change Notice Download
05/05/2017E-17-004332-C - E-17-004332 has been canceled.Product Change Notice Download