5745781-4
09 MSFL RCPT RA 318 (IN,FM)
Enhance your connectivity with our high-performance D-Sub Connector. Engineered for reliability, this receptacle features a durable thermoplastic housing and UL 94V-0 compliance for added safety. With nine gold-plated contacts and a 6A amperage rating, it ensures efficient power transmission. The two-row design with a 2.74mm pitch accommodates multiple connections, while the threaded insert mating retention type offers secure attachment. Perfect for board mounting, this connector is RoHS compliant, making it an environmentally responsible choice. Upgrade your electronic systems with this essential component for seamless data transfer and signal integrity.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745781-4 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745781-4 |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Insert Material: | Zinc |
| Post Size: | .66 mm / .026 in |
| Shell Material: | Carbon Steel |
| Plastic: | No |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| Contact Base Material: | Phosphor Bronze |
| PCB Thickness (Recommended): | .062 in / 1.58 mm |
| Centerline (Pitch): | .108 in / 2.74 mm |
| Housing Material: | Thermoplastic |
| UL Flammability Rating: | UL 94V-0 |
| Connector Mounting Type: | Board Mount |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Threaded Insert Material: | Zinc |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Circuit Application: | Signal |
| Footprint: | 8.08 mm / .318 in |
| Connector System: | Board-to-Board |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Shell Size: | 1 |
| Grounding Indents: | Without |
| Product Type: | Connector |
| Grounding Straps: | With |
| Sealable: | No |
| Termination Post Length: | .125 in / 3.18 mm |
| Grounding Clips: | Without |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Product Change Notice Download |
| 10/01/2021 | P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Product Change Notice Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Product Change Notice Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Product Change Notice Download |