5745784-4
37 MSFL RCPT RA 318 (IN,FM)
Enhance the connectivity of your electronic devices with this high-performance D-Sub connector. Designed to meet UL 94V-0 standards for safety, it boasts a durable thermoplastic housing and gold-plated phosphor bronze contacts for optimal conductivity. With 37 contacts arranged in two rows, it provides ample connectivity for your applications. The board mount design ensures secure installation, while the threaded insert mating retention type adds further stability. RoHS compliant, this connector is environmentally friendly, making it a reliable choice for your projects in various industries.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745784-4 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 37 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 37 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745784-4 |
| Shell Material: | Carbon Steel |
| Insert Material: | Zinc |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Plastic: | No |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.58 mm |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | .108 in / 2.74 mm |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Threaded Insert Material: | Zinc |
| Connector Mounting Type: | Board Mount |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Circuit Application: | Signal |
| Footprint: | 8.08 mm / .318 in |
| Connector System: | Board-to-Board |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Grounding Indents: | Without |
| Product Type: | Connector |
| Shell Size: | 4 |
| Grounding Straps: | With |
| Sealable: | No |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Product Change Notice Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Product Change Notice Download |