5748909-1
AMP III RCPT 25P RA 590 THD INS/BDLK
Introducing the AMP III RCPT 25P RA 590 THD INS/BDLK, a high-performance D-Sub connector that meets UL 94V-0 standards for superior safety and reliability. Featuring 25 gold-plated contacts, this receptacle is designed for seamless board mount installation, with a pitch of 2.74mm. With a current rating of 2.7A, it offers efficient power transmission for a wide range of applications. The all-plastic shell construction ensures durability, while the phosphor bronze contact material guarantees optimal conductivity. RoHS compliant, this connector is not only environmentally friendly but also meets the latest industry regulations. Perfect for use in industrial, commercial, and consumer electronic devices, the AMP III RCPT 25P RA 590 THD INS/BDLK is a versatile and dependable connectivity solution.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5748909-1 |
| Amperage: | 2.7 A |
| Gender: | Receptacle |
| Number of Contacts: | 25 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 25 |
| Profile: | Standard |
| Packaging: | Package |
| Shell Type: | All Plastic |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5748909-1 |
| Eyelet Material: | Brass |
| Plastic: | Yes |
| Eyelet Plating Material: | Tin |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Housing Material: | Nylon GF / Polyester GF |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mount Retention: | With |
| PCB Mounting Style: | Through Hole |
| Boardlock Material: | Copper Alloy |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Mating Connector Lock Type: | Threaded Inserts |
| Threaded Insert Plating Material: | Clear Chromate |
| Threaded Insert Material: | Zinc |
| Boardlock Plating Material: | Tin |
| Connector Mounting Type: | Board Mount |
| PCB Mount Retention Type: | Boardlock |
| Circuit Application: | Signal |
| Grounding Straps: | Without |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Product Type: | Connector |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Footprint: | 14.99 mm / .59 in |
| Shell Size: | 3 |
| Grounding Indents: | Without |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |