5788796-1
09 HTMSFL ASSY RA 318 (IN,BL)
Enhance your electronic connections with this high-performance D-Sub connector, featuring UL 94V-0 compliance for superior safety. With a durable thermoplastic housing and gold-plated phosphor bronze contacts, it ensures reliable power transmission at 6A. The receptacle design, with 9 contacts in 2 rows, offers seamless board mounting. Its threaded insert mating retention and front metal shell guarantee secure assembly. RoHS compliant and packaged in a convenient tray, this connector is a must-have for efficient and compliant data transfer solutions.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5788796-1 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5788796-1 |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Post Size: | .026 in |
| Insert Material: | Zinc |
| Plastic: | No |
| Shell Material: | Steel |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.57 mm / .062 in |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | .108 in / 2.74 mm |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Connector Mounting Type: | Board Mount |
| Mating Connector Lock Type: | Threaded Inserts |
| Mating Alignment: | With |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| PCB Mount Retention: | With |
| Mating Retention: | With |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention Type: | Boardlock |
| Threaded Insert Material: | Zinc |
| Threaded Insert Plating Material: | Clear Chromate |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Alignment: | With |
| Boardlock Material: | Copper Alloy |
| Mounting Hole Diameter: | .1 mm |
| Boardlock Plating Material: | Tin |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shell Size: | 1 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounding Straps: | With |
| Product Type: | Connector |
| Grounding Clips: | Without |
| Termination Post Length: | 3.18 mm / .125 in |
| High Temperature Housing: | Yes |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Product Change Notice Download |