5788796-1
09 HTMSFL ASSY RA 318 (IN,BL)
Enhance your electronic connections with this high-performance D-Sub connector, featuring UL 94V-0 compliance for superior safety. With a durable thermoplastic housing and gold-plated phosphor bronze contacts, it ensures reliable power transmission at 6A. The receptacle design, with 9 contacts in 2 rows, offers seamless board mounting. Its threaded insert mating retention and front metal shell guarantee secure assembly. RoHS compliant and packaged in a convenient tray, this connector is a must-have for efficient and compliant data transfer solutions.
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 5788796-1 |
Amperage: | 6 A |
Gender: | Receptacle |
Housing Material: | Thermoplastic |
Number of Contacts: | 9 |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Phosphor Bronze |
Contact Plating: | Gold |
Number of Positions: | 9 |
Profile: | Standard |
Mating Retention Type: | Threaded Insert |
Shell Type: | Front Metal Shell |
Standards Met: | UL 94V-0 |
SKU: | AMP5788796-1 |
Eyelet Plating Material: | Tin |
Eyelet Material: | Brass |
Shell Plating Material: | Tin |
Post Size: | .026 in |
Insert Material: | Zinc |
Plastic: | No |
Shell Material: | Steel |
PCB Mount Orientation: | Right Angle |
Preloaded: | Yes |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating Material: | Tin |
Contact Mating Area Plating Thickness: | 30 µin |
Contact Base Material: | Phosphor Bronze |
Contact Shape and Form: | Round |
PCB Thickness (Recommended): | 1.57 mm / .062 in |
Housing Material: | Thermoplastic |
Centerline (Pitch): | .108 in / 2.74 mm |
Housing Color: | Black |
UL Flammability Rating: | UL 94V-0 |
Connector Mounting Type: | Board Mount |
Mating Connector Lock Type: | Threaded Inserts |
Mating Alignment: | With |
Mating Connector Lock: | With |
Panel Mount Feature: | Without |
PCB Mount Retention: | With |
Mating Retention: | With |
PCB Mounting Style: | Through Hole |
PCB Mount Retention Type: | Boardlock |
Threaded Insert Material: | Zinc |
Threaded Insert Plating Material: | Clear Chromate |
Montageausrichtung der Leiterplatte: | With |
PCB Mount Alignment: | With |
Boardlock Material: | Copper Alloy |
Mounting Hole Diameter: | .1 mm |
Boardlock Plating Material: | Tin |
Circuit Application: | Signal |
Footprint: | .318 in / 8.08 mm |
Connector System: | Board-to-Board |
Sealable: | No |
Grounding Indents: | Without |
Shell Size: | 1 |
Row-to-Row Spacing: | .112 in / 2.84 mm |
Connector and Contact Terminates To: | Printed Circuit Board |
Grounding Straps: | With |
Product Type: | Connector |
Grounding Clips: | Without |
Termination Post Length: | 3.18 mm / .125 in |
High Temperature Housing: | Yes |
Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |