Enhance your PCB connectivity with this high-performance MICT assembly, featuring 114 .025-inch pins for seamless signal transmission. With CSA and UL certifications and a housing made of LCP, a durable Liquid Crystal Polymer, this connector ensures reliability and safety. Designed for board mount and surface mount applications, it offers a pitch of .64mm and supports data rates up to 10Gb/s. Each package includes 10 units, with gold-plated contact mating areas for optimal conductivity. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for diverse environments. Its dual-beam contact shape and ground bus component enhance signal integrity, making it ideal for demanding circuit applications. The connector's vertical mount orientation and 5.79mm row spacing provide efficient PCB connectivity, while features like boardlock retention and locating posts ensure secure assembly. With its robust design and high-speed capabilities, this MICT assembly is a versatile solution for your PCB interconnection needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 767032-3
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 2
Mount Type: Board Mount
Termination Method: Surface Mount
Contact Material: Copper Alloy
Pitch: .025 in, .64 mm
Voltage: 30 V AC, 3 V DC
Contact Type: Pin
Row Spacing: .228 in, 5.79 mm
Impedance: 50 Ω
Package Quantity: 10
Contact Amperage: 11.5 A
Number of Positions: 114
Data Rate: 10 Gb/s
Housing Color: Black
Mount Orientation: Vertical
Insulation Resistance: 2 MΩ
GPL: 481
Packaging: Box & Tube, Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 30 µin, .76 µm
PCB Retention: With
PCB Contact Termination Area Plating: Tin-Lead
PCB Thickness (Recommended): 1.57 mm, .8 in
Connector Height: 19.812 mm, .78 in
PCB Retention Type: Boardlock
Sealable: No
Ground Component Type: Ground Bus
Mating Alignment: Without
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 3124
Number of Columns: 57
Number of Power Positions: 3
Number of Signal Positions: 114
Contact Layout: Inline
Connector Length: 2 in, 50.8 mm
Connector System: Board to Board
CSA Agency Certification: 1195944
UL Agency Certification: E28476
Stackable: No
ECCN: EAR99
Board to Board Configuration: Mezzanine
Contact Shape: Dual Beam
Connector Width: .32 in, 8.128 mm
Mating Retention: With
PCB Mount Alignment: With
PCB Mount Alignment Type: Boardlock, Locating Posts
Application Assembly Feature: None
Differential Signaling: Yes
Header Type: Header Only
Connector Assembly Type: PCB Mount Header
Stack Height: 1.143 in, 20 mm, 29 mm
PCB Contact Termination Area Plating Thickness: 150 - 250 µin
Standards Met: CSA
Material Flammability Standard: UL 94V-0
Part Aliases: 767032-3
Replacement Part: 5767032-3
SKU: AMP767032-3

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: