15-28-6181
Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 18 Circuits, PA Polyamide Nylon 6/6, UL 94V-2, Select Gold (Au) Plating, without Drain Holes
Part Aliases: Molex 0015286181 Molex A-42440-1812
The Mini-Fit BMI Header, a high-performance connector designed for seamless board-to-board and wire-to-board connections. With a 4.20mm pitch and dual-row configuration, this vertical header features a secure snap-in plastic peg PCB lock, ensuring reliable mating. Constructed with 18 circuits, it is made of PA Polyamide Nylon 6/6 with UL 94V-2 flammability standard compliance. The Select Gold (Au) plating offers excellent conductivity, while the absence of drain holes enhances environmental protection. Operating at 13 A and 600 V, this connector is suited for a wide range of applications. Its straight body orientation, through-hole termination method, and brass contact material guarantee durability and stability. Whether for industrial machinery, telecommunications, or consumer electronics, the Mini-Fit BMI Header provides a dependable interconnect solution, meeting RoHS compliance and various agency certifications. Stay connected with confidence.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 15-28-6181 |
Color: | Natural |
Series: | 42440 - Mini-Fit BMI |
Amperage: | 13 A |
Connector Type: | Mini-Fit BMI |
Number of Contacts: | 18 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Straight |
Pitch: | 4.2 mm |
Voltage: | 600 V |
Material: | Nylon |
Orientation: | Vertical |
Tail Length: | 3.56 mm |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 18 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1.8 mm |
Connector System: | Board to Board, Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 240 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Glow Wire Capable: | No |
Guide to Mating Part: | Yes |
Lock to Mating Part: | Yes |
Stackable: | No |
Surface Mount Compatible: | No |
Breakaway: | No |
Shroud Type: | Partial |
Material Flammability Standard: | 94V-2 |
Part Aliases: | 0015286181 A-42440-1812 |
SKU: | MOL15-28-6181 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
06/20/2025 | 516254 - Capacity Change or Tool Replacement. Molex Lincoln Nebraska is adding replacement tooling impacting the parts in the attached list. There will be no impact to the Form, Fit, Function or Appearance of the Housings produced from this tooling when compared to the current tooling. There will also be no impact to the Finished Goods Form, Fit, Function or Appearance that uses the produced Housings. | Download |
12/24/2018 | 506262 - Capacity Change or Tool Replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download |