150200-0011
Ditto Hermaphroditic Crimp Terminal, Copper Nickel, Select Gold Plating, 20-22 AWG, for High-Temperature (-40° to +150°C) Housing
Part Aliases: Molex 1502000011
Enhance your wire-to-wire connections with our Ditto Hermaphroditic Crimp Terminal. Crafted from durable Copper Nickel with Select Gold Plating, it guarantees reliable performance in high-temperature environments ranging from -40°C to +150°C. Suitable for 20-22 AWG wires, this terminal ensures secure power transmission with an amperage of 6 A and a voltage rating of 350 V AC/DC. Its versatile design, featuring a crimp or compression termination method, caters to various installation preferences. The contact's Gold plating and Tin termination further enhance conductivity and durability, while its hermaphroditic gender ensures seamless mating. Perfect for power circuit applications, this terminal is a dependable choice, meeting RoHS compliance standards for environmental responsibility. Elevate your connectivity with the Ditto Wire-to-Wire Interconnects series.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 150200-0011 |
| Series: | 150200 - Ditto |
| Amperage: | 6 A |
| Connector Type: | Ditto |
| Gender: | Hermaphroditic |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Nickel |
| Voltage: | 350 V AC/DC |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Mating Cycles: | 100 |
| Wire Size: | 20 AWG, 22 AWG |
| Connector System: | Wire to Wire |
| Contact Termination Plating: | Tin |
| Wire Insulation Diameter: | 1.35 - 1.7 mm |
| Part Aliases: | 1502000011 |
| SKU: | MOL150200-0011 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |