26-60-4140
KK 396 Header, Vertical, Friction Lock, 14 Circuits, Tin (Sn) Plating
Part Aliases: Molex 0026604140 Molex 41791-0014
Enhance your PCB connectivity with our KK 396 Vertical Header, featuring 14 circuits for seamless integration. Designed for durability, it boasts a straight body orientation and friction lock mechanism, ensuring secure mating. With tin plating and brass contact material, it offers reliable performance with a 7A amperage and 250V voltage rating. RoHS compliant and UL certified, this connector guarantees safety and quality. Perfect for wire-to-board applications, it's a must-have for efficient PCB assembly. Elevate your electronic projects with the KK 396 Vertical Header.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-60-4140 |
| Color: | Natural |
| Series: | 41791 - KK 396 |
| Amperage: | 7 A |
| Connector Type: | KK 396 |
| Number of Contacts: | 14 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3.96 mm |
| Voltage: | 250 V |
| Material: | Polyester |
| Orientation: | Vertical |
| Tail Length: | 3.56 mm |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 5.08 µm |
| Number of Contacts Loaded: | 14 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 5.08 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 235 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | Yes |
| Breakaway: | No |
| Shroud Type: | Partial |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0026604140 41791-0014 |
| SKU: | MOL26-60-4140 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Product Change Notice Download |
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Product Change Notice Download |
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Product Change Notice Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Product Change Notice Download |
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Product Change Notice Download |
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Product Change Notice Download |