43202-8916
Modular Jack, Right Angle, Low Profile, Shielded, No Panel Grounding Tabs, with Bottom Grounding Tab, Front Position PCB Ground Tab, 8/8
Elevate your networking setup with our high-performance Modular Jack, designed for seamless connectivity in tight spaces. This Right Angle, Low Profile, Shielded connector features innovative design elements such as No Panel Grounding Tabs, a Bottom Grounding Tab, and a Front Position PCB Ground Tab. With 8/8 RJ45 configuration, it ensures reliable data transmission, while the durable construction of Brass and Phosphor Bronze with Gold plating guarantees long-lasting quality. Suitable for panel mounting with Through Hole termination, this connector is ideal for various applications, from telecommunications to industrial environments. Rest assured of its safety and compliance with industry standards, including RoHS, CSA, and UL certifications. Upgrade your network infrastructure with this essential component.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 43202-8916 |
| Color: | Black |
| Series: | 43202 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Ground to Panel / PCB: | No |
| Mating Cycles: | 500 |
| Panel Mount: | With |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.57 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.27 mm |
| Surface Mount Compatible: | Yes |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0432028916 |
| SKU: | MOL43202-8916 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download |
| 11/01/2017 | 501881 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or appearance of the parts. Or, it may result in a change to the specification. | Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download |