43650-0900
Micro-Fit 3.0 Right Angle Header, 3.00mm Pitch, Single Row, 9 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Glow Wire Capable, Black
Introducing the Micro-Fit 3.0 Right Angle Header, a precision-engineered component designed for seamless PCB connectivity. With a 3.00mm pitch and single-row configuration, this header boasts 9 circuits, making it ideal for various electronic applications. Featuring a snap-in plastic peg PCB lock for secure attachment, it ensures reliable performance. The black, glow wire-capable housing is crafted from high-temperature thermoplastic, guaranteeing durability in harsh environments. With a current rating of 8.5A and voltage tolerance of 600V, it meets stringent industry standards. The brass contact material, plated with tin, offers excellent conductivity. Its right-angle orientation and through-hole termination method simplify installation. RoHS compliant and lead-free process capable, this connector prioritizes environmental sustainability. Perfect for wire-to-board connections, the Micro-Fit 3.0 series delivers exceptional quality and performance in PCB applications.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 43650-0900 |
| Color: | Black |
| Series: | 43650 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 9 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 9 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Mated Height: | 6.98 mm |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0436500900 |
| SKU: | MOL43650-0900 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. |
Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. |
Download |
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |