43860-0010
Modular Jack, Right Angle, Low Profile, Inverted, Shielded, All Panel Grounding Tabs, Lightpipes, 8/8
Enhance your connectivity solutions with this advanced Modular Jack. Featuring a Right Angle, Low Profile design with Shielding and All Panel Grounding Tabs, it ensures optimum performance in any setup. Equipped with Lightpipes and 8/8 configuration, it guarantees seamless data transmission. The female RJ45 connector is mounted on panels, offering easy installation. Constructed with durable materials like Polycarbonate and High Temperature Thermoplastic, it can withstand harsh environments. With Gold contact plating and Phosphor Bronze contacts, it ensures reliable signal transmission. Certified for quality and safety, it meets CSA and UL standards. Its innovative design, including PCB mounting and retention features, makes it the perfect choice for Ethernet and Fiber Optic applications. With RoHS compliance and lead-free soldering capabilities, it's also environmentally friendly. Upgrade your network infrastructure with this top-of-the-line RJ Connector.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 43860-0010 |
| Color: | Black, Clear |
| Series: | 43860 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic, Polycarbonate |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Ground to Panel / PCB: | Yes |
| Mating Cycles: | 500 |
| Panel Mount: | With |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.02 mm |
| Surface Mount Compatible: | No |
| Waterproof Dustproof: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0438600010 |
| SKU: | MOL43860-0010 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 09/30/2024 | 515041 - Change Supplier. This notification is to inform you about Modjack products’ current light pipe mold is going end of life, Molex ChengDu will replace it with new copy mold from a different supplier. |
Download |
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download |
| 01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download |
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download |