44432-2210
Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 22 Circuits, Tin (Sn) Plating, Straight Tails
Enhance connectivity with our Micro-Fit BMI Header, meticulously designed for optimal performance. Crafted for surface mount compatibility, this dual-row connector features a vertical orientation and a convenient PCB polarizing peg for seamless integration. With 22 circuits and durable tin plating, it ensures reliable power delivery with a maximum amperage of 8.5 A and voltage of 250 V AC/DC. The high-temperature thermoplastic construction guarantees longevity, while brass contact material and through-hole termination method offer secure and efficient connections. Meeting stringent UL and CSA agency certifications, this header is suitable for board-to-board and wire-to-board applications, making it a versatile and essential component for your projects. RoHS compliant and meticulously tested for quality, it's the perfect choice for demanding environments where reliability is paramount. Elevate your connectivity solutions with our Micro-Fit BMI Header.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 44432-2210 |
Color: | Black |
Series: | 44432 - Micro-Fit BMI |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit BMI |
Number of Contacts: | 22 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Pitch: | 3 mm |
Voltage: | 250 V AC/DC |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Tail Length: | 3.3 mm |
Packaging: | Tray |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 5.08 µm |
Number of Contacts Loaded: | 22 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 1.27 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 2.54 mm |
Connector System: | Board to Board, Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | SMC and Wave |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | No |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit BMI |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0444322210 |
SKU: | MOL44432-2210 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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09/09/2022 | 512124 - Change Supplier. This notification is to inform you that a Supplier to Molex Lincoln Nebraska is adding an additional supplier source that will impact the part(s) attached as per list. No changes will be made to product as part of this change. Supplier source to Molex Lincoln Nebraska will be unchanged. | Download |