47571-0001
1.10mm Pitch microSD Card Header with Detect Switch, Height 2.30mm, Lead-Free, 0.762
Enhance your device's storage capabilities with our MicroSD Card Connector. Designed for seamless integration, this black connector features a durable thermoplastic housing and copper alloy contacts plated with gold over nickel for reliable performance. With a low operating temperature of -40°C and a maximum of 85°C, it ensures stability in various environments. Its surface mount termination method and 1.1mm pitch make for easy installation on your PCB. RoHS compliant and lead-free process capable, it prioritizes environmental responsibility. Whether for industrial or consumer applications, this MicroSD Card Connector guarantees efficient data transfer and secure connectivity. Upgrade today and experience enhanced storage solutions.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 47571-0001 |
| Color: | Black |
| Series: | 47571 - microSD Card |
| Amperage: | .5 A |
| Connector Type: | microSD Card |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 8 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 1.1 mm |
| Voltage: | 5 V DC |
| Material: | High Temperature Thermoplastic |
| Shell Material: | Stainless Steel |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 10000 |
| PCB Locator: | No |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating: | Nickel |
| Maximum Solder Process Temperature: | 255 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 020 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Termination Pitch: | 1.1 mm |
| Electrical Model: | Yes |
| Card Detection Switch: | Open |
| Card Entry Location: | Front |
| Part Aliases: | 0475710001 |
| SKU: | MOL47571-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. |
Download |
| 11/20/2023 | 513631 - Change to Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change will affect the Fit, Form, Function, or appearance of the parts. Or it may result in a change to the specification or raw material. |
Download |
| 03/16/2022 | 511324 - Change supplier. Add Alternative resin Materials "WOTE LCP KD130i" Change reason is due to existing resin supplier polyplastics capacity constraint issue. we must qualify local LCP supplier WOTE to avoid production line down. | Download |
| 12/30/2021 | 510157 - Change to Product. the old footprint reference dimensions are not right, correcting the dimensions of the footprint int he SD drawing. | Download |
| 01/01/2016 | GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. | Download |