78800-0001
1.50mm Height Hinged-style micro-SIM Card Socket without Detect Switch, Surface Mount, 6 Circuits, Low-Halogen, Lead-Free
Part Aliases: Molex 0788000001
Introducing our Micro-SIM Connector, part of the 78800 series. Designed for seamless surface mount installation, this connector features a durable stainless steel shell and gold-plated copper alloy contacts for reliable performance. With a voltage rating of 5 V DC and a maximum operating temperature of 85 °C, it's suitable for a wide range of applications. RoHS compliant and lead-free process capable, it meets stringent environmental standards. Ideal for memory card connectivity, this connector offers a secure and efficient solution for your electronic devices.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 78800-0001 |
| Series: | 78800 - micro-SIM |
| Amperage: | .5 A |
| Connector Type: | micro-SIM |
| Number of Contacts: | 6 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -30 °C |
| Pitch: | 2.54 mm |
| Voltage: | 5 V DC |
| Compatible Card Type: | Micro-SIM |
| Shell Material: | Stainless Steel |
| Operating Temperature Range: | -30 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | 2.54 mm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 5000 |
| PCB Locator: | No |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Card Detection Switch: | No |
| Card Entry Location: | Top |
| Part Aliases: | 0788000001 |
| SKU: | MOL78800-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download |
| 11/18/2017 | 502609 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download |