95503-2884
Modular Jack, Vertical, Top Entry, Through Hole, 8/8, No Key Version, Short, Tray
Part Aliases: Molex 0955032884
Enhance your connectivity with this high-performance Modular Jack, designed for seamless integration in various electronic applications. Featuring a female RJ45 connector with 8/8 pins, it ensures reliable data transmission. The vertical, top-entry design with through-hole termination offers easy installation on PCBs. Crafted from durable materials and plated with gold over palladium nickel, this jack guarantees long-lasting performance even in demanding environments. With UL certification and RoHS compliance, it meets stringent quality standards. Suitable for surface mounting, it boasts a 1.02 mm pitch and operates effectively in temperatures ranging from -40 to 85°C. Ideal for Ethernet and fiber optic applications, this RJ connector is a versatile and essential component for your connectivity needs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 95503-2884 |
Color: | Black |
Series: | 95503 - Modular Jack 8/8 - RJ45 |
Amperage: | 1.5 A |
Connector Type: | Modular Jack 8/8, RJ45 |
Gender: | Female |
Mount Type: | Surface Mount |
Termination Method: | Through Hole |
Contact Material: | Copper Alloy |
Contact Plating: | Gold over Palladium Nickel |
Body Orientation: | Straight |
Pitch: | 1.02 mm |
Voltage: | 125 V DC |
Material: | High Temperature Thermoplastic |
Number of Ports: | 1 |
Orientation: | Vertical |
Keying: | No |
Component Type: | PCB Jack |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold over Palladium Nickel |
Contact Mating Area Plating Thickness: | .051 µm, 1.016 µm |
Mating Cycles: | 2500 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 1.905 µm |
PCB Thickness (Recommended): | 1.57 mm |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | 1.27 mm |
Surface Mount Compatible: | Yes |
Waterproof Dustproof: | No |
Non Magnetic: | Yes |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0955032884 |
SKU: | MOL95503-2884 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
01/15/2024 | 514672 - Retraction of PCN 514070. Because of resource and strategy adjustment molex decides to suspend tray material study. qualification on some products during this PCN | Download |
12/15/2023 | 514070 - Packaging Method/Quantity Changing. To unify the packaging tray material & improve tray quality, we are moving away from using PS to PET. | Download |
05/17/2022 | 511024 - Change Supplier. Adding Alternate sourcing for the terminal copper strip of modular jack as the existing source has decided manufacturing impacted material. the alternate source will support with better lead time and delivery. this will be a running change and required internal qualification will be done before implementation date. | Download |
03/30/2022 | 511458 - Change to Product. Optimize the tolerance and dimensions for SD drawings of impacted part numbers dont have any changes on the physical product. no impact to customer assembly product fit or function. | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
11/01/2020 | 508199 - Plant closure. Equipment Transfer, Production Transfer or Rearrangement to a different production location. No changes will be made to the product as a result of this move. | Download |