TE SolderSleeve Device for Space Applications

TE Connectivity (TE)’s SolderSleeve supports space applications providing a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites. SolderSleeve device for space helps provide reduced size, weight and power (SWaP) and environmentally protected shield termination on cables as well as insulation, protection and strain relief. This product can be used for splicing wires as well as shield terminations.

The space industry also demands solutions, which have minimal to zero levels of foreign object damage (FOD), in key applications. The use of flux free solder leaves no traces of particles post installation and the sealing rings helps ensure that the installation remains intact.

  • Heat shrinkable technology for one-step shield results in easy inspection
  • Transparent insulation sleeve saves time during installation
  • Provides strain relief with ratings of up to 150°C
  • Minimal tools required to achieve connection, insulation and protection
  • In-house design and quality controlled process offers reliability and traceability
  • Military / Aerospace / Aviation
  • Small, nano and cube satellites for (low earth orbit) LEO constellations
  • Launch pads
EM7793-000

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SolderSleeve Shield Terminators, 22mm for Space Applications
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EM7794-000

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SolderSleeve Shield Terminators, 23mm for Space Applications
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EM7795-000

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SolderSleeve Shield Terminators, 24mm for Space Applications
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