TE RBK-X1 Processor for Raychem Heat Shrink Products

TE Connectivity's (TE) latest advancement in heat shrink processing, the RBK-X1, is specifically designed for consistent, repeatable wire sealing for a wide range of Raychem heat shrink products. The RBK-X1 processor is a semi-automatic unit designed specifically for sealing wire bundles, splice, and ring terminals. It includes long-life heating elements, operator key lock/password protection levels, individual selections for installation times, temperature and product size information. This competitively priced alternative to less measurably reliable heat guns offers a small footprint, simple touch screen interface, and the ability to interface with an upstream ultrasonic welder.

  • Fast, affordable alternative to heat guns
  • Semi-automatic unit designed to seal products for wire bundles, splice terminals and ring terminals
  • Includes long-life heating elements with operator key lock/password protection levels
  • Offers reliable PLC (Programmable Logic Controller) control with short machine depth to accommodate a larger front working area
  • Short profile with fast, consistent processing speeds (as low as 6 seconds)
  • Flexible design with multiple operation modes namely, stand-alone, sequenced and communication with upstream ultrasonic welder
  • Industrial (non-Robotics)
  • Appliance & HVAC
  • Automotive (non-EV)
  • Distributors
  • Wire bundles
  • Splice terminals
  • Ring terminals
  • AD&M